Application of PPS in Electronic Components

With the rapid development of microelectronic integration technology and assembly technology, the assembly density has rapidly increased, the volume of electronic components and logic circuits has shrunk thousands of times, electronic instruments have become thinner and smaller, while the operating frequency has increased dramatically, and the semiconductor thermal environment has rapidly changed towards high temperature. At this time, the heat generated by electronic equipment rapidly accumulates and increases, and the electronic components can still work normally with high reliability under the operating ambient temperature. The timely heat dissipation capability has become an important limiting factor affecting their service life.
In order to ensure the operation reliability of components, it is urgent to develop thermal conductive and insulating polymer composites with high reliability and high heat dissipation, which have excellent comprehensive performance, to replace traditional polymer materials. As thermal interface and packaging materials, they can quickly transfer the heat of heating components to heat dissipation equipment to ensure the normal operation of electronic equipment.
Polyphenylene sulfide (pps) is a lightweight, high-performance material. the applications of electronics, automobiles, precision machinery and aerospace, military equipment are increasingly valued, especially in the application of new composite materials. Pps chain link structural unit is very simple. the rigid monomer endows the material with high strength and stiffness retention at high temperatures, with strong crystallization trend and high crystallinity. But also because there are a lot of benzene rings on the main chain of pure pps, which has high crystallinity, its tensile strength and toughness Poor impact resistance; On the other hand, pps has low thermal conductivity, which is a bad conductor of heat. These shortcomings limit its application to a certain extent. Therefore, it is necessary to study the modification of PPS materials.
The existing modification methods of polyphenylene sulfide mainly focus on: 1. adding glass fiber reinforcement to improve the mechanical strength of pps; 2. Add thermal conductive filler to improve the thermal conductivity of pps. However, the addition amount of glass fiber and thermal conductive filler often needs a higher proportion to have a significant improvement effect. When the glass fiber content is too high, it will bring great difficulties to the processing, and the resulting products are often easy to expose the glass fiber, or even deteriorate the performance; The thermal conductive filler is a rigid material, and the direct addition of pps will easily lead to the brittleness enhancement of pps, and a small amount of thermal conductive filler will also be difficult to form a sufficient thermal conduction path in pps, thus the thermal conductivity is poor.
Therefore, the modification of PPS materials has certain technical difficulties, and it also needs to go through multiple formula tests for actual product verification before passing. After research and development, Napan's technical team can provide a kind of pps material for electronic device shell, which has high tensile strength, high impact resistance, high bending strength and excellent thermal conductivity.